The IEEE Electrical Design of Advanced Packaging & Systems symposium
The IEEE Electrical Design of Advanced Packaging & Systems symposium has been one of the most important events in Asia Pacific region for the researchers and developers related to the electrical design issues on chip, package and system levels.
The EDAPS symposium consists of paper presentations, industry exhibitions, workshops and tutorials.
The 2013 EDAPS will be held in Nara of Japan from December 12 to 14, 2013. Additionally, a special joint workshop with EMC Compo2013 will be embedded on Dec. 15th.
The technical program of the symposium not only addresses the current technical issues but also brings out the challenges facing IC design, SiP/SoP packaging, EMI/EMC, and EDA tools and most importantly the challenge issues in advanced 3-D IC and packaging design.
The symposium provides a major platform for researchers, designers and developers from diverse fields to exchange knowledge and build up network and community.
Paper Topics of Interest
Signal Integrity
Substrate Technology for Package and PCB
Power Integrity / Ground Noise
Time/Frequency Domain Measurement Techniques
3DIC / 3D-Stacked IC
SiP/SoP
Embedded Passives
Electromagnetic Compatibility (EMC)
Design and Modeling for High-speed Channels and Interconnects
Package Reliability
RF/Microwave Package
Advanced Simulation Tools and CAD
Testing on 3DIC and SiP
Others
