Matter & Light

Researchers led by the University of Osaka developed a reusable light-responsive adhesive that switches adhesion at the interface instead of weakening the whole material. UV-A light reduces interfacial adhesion, enabling selective peeling without observable residue, while UV-C light restores adhesion. The response was retained through repeated cycles without solvent processing. The approach could simplify disassembly, repair, and recycling of electronics, vehicles, and semiconductor components, supporting more circular manufacturing across industries.