Engineering & Technology Materials Science and Engineering

Mass production technology for silicon based ultraviolet (UV) light sensors, suitable for smartphones and wearable devices in the Internet of Things (IoT) era, has been jointly developed by a research team at Tohoku University and SII Semiconductor Corporation, a semiconductor manufacturer at Seiko Instruments Group.

A new technique for investigating the action of molybdate on carbon steel could lead to safer treatments for protecting metal alloys.

The Hong Kong Polytechnic University launched today the University Research Facility in 3D Printing (U3DP), the first 3D printing facility among higher education institutions in Hong Kong to support teaching, learning and research.

A team from Korea created more flexible neural electrodes that minimize tissue damage and still transmit clear brain signals.

An ultrathin semiconducting sheet showing gas-responsive electronic properties may lead to highly sensitive gas sensors.