ECO-MATES 2011: International Symposium on Materials Science and Innovation for Sustainable Society - Eco-Materials and Eco-Innovation for Global Sustainability

In ECO-MATES 2011, the next generation eco-materials and eco-technological innovations in all industrial fields will be discussed.

Recent activities for preventing global warming by establishing energy-saving technologies based on resource-circulation systems have brought numerous innovations in industry and human society. These flowers of efforts should come to fruition within a decade. In this symposium, the innovations in electronics and materials science are discussed from various perspectives on the basis of the latest research results on eco-electronics and eco-materials technology. The information exchanged during the symposium will stimulate further innovations in these fields. This symposium should contribute to establish the sustainable low carbon society.

In ECO-MATES 2011, the next generation eco-materials and eco-technological innovations in all industrial fields will be discussed. The eco-material flow should be taken into consideration for energy saving and materials recycling. The technological innovations are necessary for establishing the resource-circulating society. Interested parties are cordially invited to this symposium which will focus on the following essential themes with respect to eco-materials and innovation for sustainable society:

Eco-materials for eco-design, eco-process, eco-energy.
Solid or liquid state nano-materials processing, and nano-fabrication.
Light materials / Porous materials / Functional materials / Novel ceramics / Catalysts materials / Rare-earth elements.
Environmentally friendly electronics and assembly / Advanced electronic materials / Semiconductors / Power electronics and packaging.
Green technologies / Resource circulating manufacturing systems / 3R/Waste/Biomass.
Environmentally friendly materials processing / Smart processing.
Organic electronics / Photon technology / Thin film / Interconnection technology.
High density electronics packaging / Micro-joining / Nano-joining / 3D assembly.
Base materials (Iron and steel, Nonferrous metals, Organic materials).
Welding and joining / Interface joining / Spraying / Coating / Surface treatment.

For more details, including registration and submission information, please follow the links below or contact:

Secretariat general: Masakatsu Maeda
TEL&FAX: +81-6-6879-4193
E-MAIL: [email protected]

From 28 Nov 2011
Until 30 Nov 2011
Hotel Hankyu Expo Park, Osaka, Japan
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